We developed the Desktop-Micro-Factory® which, for the first time on the market, unites the production quality of a fully automatic bonder with the flexibility of a manual bonder. This un-equalled combination closes the gap between the requirements of laboratory and production. The Desktop-Micro-Factory® has no competition when it comes to achieving top quality at bottom cost. Up to now, electronic products for high demands and with high intrinsic value needed to be manufactured on fully automatic equipment even in small volumes to guarantee the required quality levels. Not so with our Desktop-Micro-Factory®. Only this technology allows bonding and testing in a single machine base – with further functions being developed. Because they no longer need to invest in two separate machines for bonding and testing, our customers save money while improving the utilization of the equipment. Our machines can handle a huge range of bonding and testing processes:
Gold-ball-Bonding, Gold and aluminium thin wire wedge bonding, Gold and aluminium thin wire wedge bonding with deep-access 90° wire feed angle, Gold and aluminium ribbon bonding, Aluminium heavy wire-wedge bonding, Copper wire bonding, Bonding of isolated wire, Heavy ribbon bonding with aluminium ribbon, Pull- and shear tests, Peel- and tweezer tests. |



