PRESS02.02.2012: 53XX-BDA Bonder now capable of DIE-Bonding:
Our popular manual wire bonder 53XX BDA was already a marvel of versatility, being extremely
simple to convert between wedge and ball-bonding. Now it adds a third functionality: the 53XX
BDA is now capable of DIE-bonding. 05.08.2010: New from Austria - WEGA 80XX
The latest addition to the product family seamlessly continues the modular
system which in the last 10 years has bestowed a series of successes upon the Austrian branch of the
F&K Delvotec group, most recently with the Desktop Micro Factory 56XX. 24.08.2009: Newsletter: 5600C
Pull-/Sheartester with automatic pattern recognition 24.08.2009: Newsletter: 5600C Automatic Pull-/Sheartester
with automatic pattern recognition 24.07.2009: 5600C Automatic Bondtester
Data Sheet 22.08.2008: Newsletter XVIII: Editors' Choice Best Product Award
together with new optimized lightsources for our series 56XX. 10.04.2008: Newsletter XVII: Sensor+Test
We present our 56XX Desktop Micro Factory and the 53XX Manual Wirebonder at the Sensor+Test Measurement Fair. 22.10.2007: Newsletter XVI: Productronica
We invite you to visit us at the Productronica. 12.09.2007: Pattern Recognition Unit (PRU) Manual
Manual for the PRU System. 30.08.2007: Newsletter XV: Tweezer tester
In addition to the current bond quality tests, like pull and shear testing, we offer the unique 56xx with a tweezer test head. That kind of test version brings you the big advantage of checking the start(first)- and destination-bond (second) independently.
10.08.2007: Newsletter XIV: PRU
We present our new Pattern Recognition Unit. 20.04.2007: Newsletter XIII: SMT Hybrid Packaging
We present - Series 5650HR, Series 53XX BDA 13.04.2007: Heavy Aluminium Ribbon Bonding (HARP) - More performance at lower cost
Technical article in EPP Europe. 13.04.2007: Bonding and testing with one machine - the universal solution
Technical article in EPP Europe. 04.04.2007: Chip-on-board Technology
After many years of development, hybrid and chip-on-board or COB technology has reached the stage where con-siderable savings in space and cost are achievable. 04.04.2007: Bond Process Control
This article provides a short description of the physical processes which occur during wire bonding and then goes on to describe the Bond Process Control Unit (BPC) developed by F&K Delvotec. The BPC is the only commercially available unit for on-line control of the bond process and is being used suc-cessfully around the world, in particular for aluminum wedge bonding. 08.01.2007: Newsletter XII: Reinforcement of our marketing team
Due to the increasing demand of our machinery and service we are reinforcing our marketing team. 06.11.2006: Newsletter XI: Wire Deformation Control
The Deformation Limit Control (DLC) is the brand new feature (optional) for our semiautomatic Bonder Series 56XX. 04.10.2006: Newsletter X: vienna-tec
We are delighted to invite you to the vienna-tec fair. There are many new and interesting things to see and talk about. Let us inform you about the latest trends and new developments in a relaxed atmosphere. 11.07.2006: Newsletter IX: Bonding and Testing with one machine
The combined Delvotec semiautomatic wire bonder and pull/shear tester series 56XX is the cost
optimised solution for your production or/and laboratory. 03.05.2006: Newsletter VIII Series 56XX, Series 53XX BDA
Combination Bonder and Pull/Shear Tester, Universal Manuel Bonder. 17.02.2006: The 56XX Desktop Micro Factory
F&K is the first and only supplier to offer such a universal concept with his Desktop Micro Factory Series 56xx. The 56xx masters all wire-bond technologies, and, in addition, bond testing on a single machine. 04.02.2006: Newsletter VII: A new machine philosophy
Four bonding methods combined with pull/shear test on one platform – a worldwide unique solution! 06.11.2005: Newsletter VI: Combination Bonder and Pull/Shear Tester Series 56XX
F&K Delvotec Semiconductor GmbH closes the technological gap between manual und automatic wire bonders. Not only - but also the functions of a pull/shear tester are integrated in one machine. 10.06.2005: Newsletter V: Our products, Services for our customers
F&K Delvotec is one of the worldwide leading producers of Die – and Wire - Bonders with independent branches in Europe, Asia and USA. 14.03.2005: Newsletter IV: Manual Bonders 5310/30, 5630 Wedge-Wedge 360° rotating bond head
We present our High quality – Manual Bonders 5310/30 and 5630 Wedge-Wedge 360° rotating bond head for the Universal machine 56XX. 07.02.2005: Newsletter III: Structural change at F&K Delvotec Semiconductor GmbH
F&K Delvotec Braunau was established on the 1st january 1995 as the Austrian branch of the F&K Group and has been changed into an independent GmbH on the 1st january 2005. 02.12.2004: Newsletter II: 10 Years F&K Delvotec GmbH Braunau
In the year as Austria became a member of the European Union, F&K Delvotec Austria was established on the 1st january 1995 in the technology park Braunau/Inn | 
